变化四：新兴先进封测技术的兴起CoWoS先进封装可谓HBM的黄金搭档。随着全球对于高性能计算（HPC）及人工智能（AI）芯片需求的持续增长，也推动了对于台积电CoWoS（Chip on Wafer on Substrate）先进封装产能的需求暴涨，虽然台积电持续扩大产能，但依然难以满足市场需求，成为了限制HPC及AI芯片产能的另一关键瓶颈。这也使得部分客户考虑寻求台积电CoWoS以外的替代方案，其中就包括英特尔的EMIB-T先进封装技术。
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"What we see is the Netherlands is hitting constraints on all sides; the way to alleviate this is to expand [labour] supply."，推荐阅读91视频获取更多信息
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But the note cautioned against treating AI as an “immediate fiscal windfall.” Before productivity fully kicks in, governments face upfront costs that could strain budgets already burdened by post-pandemic debt. Government spending explicitly earmarked for AI remains modest—often only a fraction of a percent of GDP—but a sea of hidden costs could make the transition much more difficult for budgets to handle.
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